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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 26 Apr 2000 13:40:12 -0700 |
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Hello Ivan,
The Microblasting technique that Phil speaks of is
documented in IPC-7721. (Along with other techniques)
You can also view a copy of the Microblasting
technique at:
http://www.circuittechctr.com/guides/2-3-6.htm
We use this technique frequently. You can contact me
off line if you have any additional questions.
Thanx
Bill @ 978/374-5000
--- Ivan Barrios <[log in to unmask]> wrote:
> We need to remove a small area (0.120" x 0.100") of
> soldermask from the top
> layer, without removing any of the copper
> underneath. Is there a chemical
> used to "etch" out this soldermask, and not
> compromise the copper layer
> underneath? As always, your responses are most
> welcome
>
> Ivan Barrios
>
>
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=====
Bill Butman
Circuit Technology Center
45 Research Drive
Haverhill, MA 01832
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Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
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If you need assistance - contact Keach Sasamori at [log in to unmask] or
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