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April 2000

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Subject:
From:
Bill Butman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 26 Apr 2000 13:40:12 -0700
Content-Type:
text/plain
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Hello Ivan,

The Microblasting technique that Phil speaks of is
documented in IPC-7721.  (Along with other techniques)
 You can also view a copy of the Microblasting
technique at:
http://www.circuittechctr.com/guides/2-3-6.htm

We use this technique frequently.  You can contact me
off line if you have any additional questions.

Thanx

Bill @ 978/374-5000


--- Ivan Barrios <[log in to unmask]> wrote:
> We need to remove a small area (0.120" x 0.100") of
> soldermask from the top
> layer, without removing any of the copper
> underneath. Is there a chemical
> used to "etch" out this soldermask, and not
> compromise the copper layer
> underneath? As always, your responses are most
> welcome
>
> Ivan Barrios
>
>
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=====
Bill Butman
Circuit Technology Center
45 Research Drive
Haverhill, MA 01832

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