TECHNET Archives

April 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Ivan Barrios <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 26 Apr 2000 13:14:56 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines)
We need to remove a small area (0.120" x 0.100") of soldermask from the top
layer, without removing any of the copper underneath. Is there a chemical
used to "etch" out this soldermask, and not compromise the copper layer
underneath? As always, your responses are most welcome

Ivan Barrios

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2