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April 2000

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Subject:
From:
Franklin Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 26 Apr 2000 07:39:38 -0500
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text/plain (27 lines)
Shirley


I would say the maximum allowable b&t would depend on the type of placement
equipment you have. I'm sure some equipment is more ofrgiving then other's.

As for laminates, most measurable warpage in laminates would be reduced in
the lamination process. The laminate is of course a more pliable material
then the finished rigid board and is subject to some warpage simply due to
processing/handling, etc, etc.

Franklin

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