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April 2000

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Subject:
From:
Jeff Seeger <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 25 Apr 2000 19:32:30 -0400
Content-Type:
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,
                  Thermal Management on Printed Boards
                     Heavy copper on Printed Boards

        The Greater Boston Chapter of the IPC Designer's Council will
        hold its next meeting on Tuesday, May 9th at the Best Western
        TLC Hotel in Waltham at 6pm.

        Topic and Speaker:

        Leighton MacMillan, CTO of Coretec, will present on Thermal
        Management of printed circuit boards, with additional content
        on heavy copper applications.  Current techniques with FR4
        are at their limits, even when using thermal vias and aluminum
        heatsink layers.  Thermally conductive laminates, commonly used
        in power supply applications, hold promise in coping with high
        speed and large devices whose power and thermal needs continue
        to increase.  As more applications also tend to use heavier
        copper some review of the effects of 2-ounce and higher foils
        will be included.

        Agenda:

        Please note there is a $15 meeting fee for members, $20 for
        non-members.  Pizza/soft drinks will be served.

        6:00        Arrivals and Pizza
        6:45        Chapter Business
        7:00        Leighton MacMillan, Thermal Management on PWBs

        Location/Directions:

        The Best Western TLC Hotel in Waltham is located at exit 27A
        off route 95/128, proceed east on Totten Pond Rd and the
        hotel is on the left.

        RSVP's needed:

        Please RSVP by sending an email to [log in to unmask] with
        the subject "RSVP IPC/DC" by Friday morning, May 5th.  Please
        treat this as a commitment to attend.

        President's Note:

        While we are very grateful to Lockheed for many years of use
        of their cafeteria, that space is no longer available to us.
        Therefore we've arranged for a hotel type of situation, which
        we hope will suit the group for some time to come.  While we've
        kept the meeting costs as low as possible, we do need to work
        with RSVP's to make sure we have enough space and food.  Here's
        hoping the group can work with the RSVP commitment in a very
        much "last minute" design world.

        I am very glad to welcome back Mr MacMillan to our group, he
        has presented in the past and is always an engaging and topical
        speaker.  While we've all felt the effects of increased power
        demands in various forms, the destination for all that power is
        of course heat.  If you've not yet had to make compromises in
        physical design for thermal considerations, you will!

        Mission:

        Design is not called "do" for a reason.  Done properly, the
        design process is a creative problem solving discipline.  To
        address the packaging needs of electronics for today and to-
        morrow, the physical designer needs an avenue to get exposed
        and familiar with many different techniques and technologies.

        The Greater Boston Chapter of the IPC Designer's Council is
        committed to presenting stake holders from every aspect of the
        packaging realm.  Our hope is to help you gain insight and un-
        derstanding of the many possibilities in solving core problems.

        Your help and participation are most welcome.

        Thanks and regards,
--

      Jeff Seeger                         Applied CAD Knowledge Inc
      Chief Technical Officer                  Tyngsboro, MA  01879
      jseeger "at" appliedcad "dot" com                978 649 9800
        President, Greater Boston Chatper, IPC Designer's Council

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