I also believe part of the problem is the notorious inefficiency of gold
plating baths, which is where the hydrogen gas comes from.  Besides what
Chuck has mentioned, do what you can to improve the bath efficiency.  This
includes keeping the gold concentration and bath salts at the supplier's
recommended concentrations.
Some dry films are better than others for gold plating, as they are better
able to handle the pH of the bath.
Another area to check is the dry film lamination process (optimum heat and
pressure?) and developing (don't overdevelop).

Patty
Patricia J. Goldman
PPG Industries, Inc.
412-492-5516
[log in to unmask]


-----Original Message-----
From: Chuck Brummer [mailto:[log in to unmask]]
Sent: Tuesday, April 25, 2000 3:06 PM
To: [log in to unmask]
Subject: Re: [TN] Gold leakage under Dryfilm


Gold baths are extremely good cleaners which can clean away the adhesion
promoter.
Another reason this can occur is the evolution of hydrogen gas leaving micro
environments of very high pH stripping the resist at the plating interface.
You can
try to lower the pH of your gold bath if the supplier specifications allow
or try a
different resist.

Chuck Brummer

Frank Barber wrote:

> I have a question,
>
>         Why would I see gold leakage under my dryfilm, when none of my
other
> plating leaks? (Including my sulfmate nickle!)  Any replies as to where to
> start looking would be appreciated.
>
> Thank You,
>
> Sal
>
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