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April 2000

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Subject:
From:
Chuck Brummer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 25 Apr 2000 12:05:45 -0700
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Gold baths are extremely good cleaners which can clean away the adhesion promoter.
Another reason this can occur is the evolution of hydrogen gas leaving micro
environments of very high pH stripping the resist at the plating interface.  You can
try to lower the pH of your gold bath if the supplier specifications allow or try a
different resist.

Chuck Brummer

Frank Barber wrote:

> I have a question,
>
>         Why would I see gold leakage under my dryfilm, when none of my other
> plating leaks? (Including my sulfmate nickle!)  Any replies as to where to
> start looking would be appreciated.
>
> Thank You,
>
> Sal
>
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