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April 2000

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Subject:
From:
"Mcmaster, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 20 Apr 2000 17:12:19 -0700
Content-Type:
text/plain
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text/plain (62 lines)
You might want to contact Conductor Analysis Technologies.  They have a test
vehicle that is pretty widely used.  Their feedback and analysis is very
good.

http://kumo.swcp.com/cat/

> ----------
> From:         Jim Gilbert[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Jim Gilbert
> Sent:         Thursday, April 20, 2000 8:22 AM
> To:   [log in to unmask]
> Subject:      [TN] Test Pattern
>
> Hi,
>
> I am a process engineer with a circuit board manufacturer in Ohio.  We are
> currently producing single, double, and multilayer circuit boards with
> lines/spaces down to 0.005".  Our R&D effort is directed towards process
> improvement for the manufacturing of HDI boards.  Our decision has been to
> implement product utilizing laser ablation with a RCC type of material.
> We
> have reached the point that we need a test pattern for evaluating our
> ability to plate blind vias ablated in RCC at various aspect ratios.  Is
> anyone aware of such a test pattern made available?
>
> I can be reached via email at [log in to unmask]
>
> Thanks,
>
> Jim Gilbert / Electronic Circuits & Design
>
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