Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 20 Apr 2000 17:12:19 -0700 |
Content-Type: | text/plain |
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You might want to contact Conductor Analysis Technologies. They have a test
vehicle that is pretty widely used. Their feedback and analysis is very
good.
http://kumo.swcp.com/cat/
> ----------
> From: Jim Gilbert[SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.;Jim Gilbert
> Sent: Thursday, April 20, 2000 8:22 AM
> To: [log in to unmask]
> Subject: [TN] Test Pattern
>
> Hi,
>
> I am a process engineer with a circuit board manufacturer in Ohio. We are
> currently producing single, double, and multilayer circuit boards with
> lines/spaces down to 0.005". Our R&D effort is directed towards process
> improvement for the manufacturing of HDI boards. Our decision has been to
> implement product utilizing laser ablation with a RCC type of material.
> We
> have reached the point that we need a test pattern for evaluating our
> ability to plate blind vias ablated in RCC at various aspect ratios. Is
> anyone aware of such a test pattern made available?
>
> I can be reached via email at [log in to unmask]
>
> Thanks,
>
> Jim Gilbert / Electronic Circuits & Design
>
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