 
| Subject: | |
| From: | |
| Reply To: | Larry W. Burgess |
| Date: | Thu, 20 Apr 2000 09:33:05 -0700 |
| Content-Type: | text/plain |
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Hello Jim,
Probably the best test pattern I have seen to date is the one that ITRI has been using recently. I am not sure, but you should be able to get it from them. Jack Fisher is a good contact for this at ITRI.
There was a paper delivered at the recent IPC Expo 2000 on some very impressive work with Pulse plating of very small blind microvias. This technique and equipment should find it's way into the industry soon.
If you are looking for a simple test vehicle, I have a design for a test coupon, I call the BGA BizCard (size of a business card that will allow you to test your plating for three level laser drilled interconnections. This has been a challenge for several fabricators. I can send you the Gerber design data for this 6 layer coupon with multiple depth blind microvia on both sides, if you wish.
Regards,
Larry
LaserVia Drilling Centers
----- Original Message -----
From: Jim Gilbert <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, April 20, 2000 8:22
Subject: [TN] Test Pattern
> Hi,
>
> I am a process engineer with a circuit board manufacturer in Ohio. We are
> currently producing single, double, and multilayer circuit boards with
> lines/spaces down to 0.005". Our R&D effort is directed towards process
> improvement for the manufacturing of HDI boards. Our decision has been to
> implement product utilizing laser ablation with a RCC type of material. We
> have reached the point that we need a test pattern for evaluating our
> ability to plate blind vias ablated in RCC at various aspect ratios. Is
> anyone aware of such a test pattern made available?
>
> I can be reached via email at [log in to unmask]
>
> Thanks,
>
> Jim Gilbert / Electronic Circuits & Design
>
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