Hi,

I am a process engineer with a circuit board manufacturer in Ohio.  We are
currently producing single, double, and multilayer circuit boards with
lines/spaces down to 0.005".  Our R&D effort is directed towards process
improvement for the manufacturing of HDI boards.  Our decision has been to
implement product utilizing laser ablation with a RCC type of material.  We
have reached the point that we need a test pattern for evaluating our
ability to plate blind vias ablated in RCC at various aspect ratios.  Is
anyone aware of such a test pattern made available?

I can be reached via email at [log in to unmask]

Thanks,

Jim Gilbert / Electronic Circuits & Design

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