TECHNET Archives

April 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Ed Cosper <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 20 Apr 2000 08:06:52 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (71 lines)
I would start with drilling. If the drill parameters are not correct (i.e.
feeds and speeds) or if the drill quality is poor, the drill process may be
introducing resin smear to the extent that the desmear process is not
capable of removing it.

If drill parameters are acceptable and hole quality is fine ( meaning no
rough gouging or nail heading ) then the next place I would look is at the
desmear process.


Ed Cosper
ABC
----- Original Message -----
From: "Smith, David V." <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, April 19, 2000 5:33 PM
Subject: [TN] PCB question


> A question for the PCB gurus:
>
> We have been receiving boards from a supplier that are exhibiting
> separations at the interface between plated hole wall and internal layers
> (a.k.a. interplane separations, post separations, interconnect defects) in
> cross-section, after thermal stress. Specifically, the separations are
> occurring between the electroless copper and electrolytic copper.
Horizontal
> cross-sectioning reveals that the location of the separations is
consistent
> from hole to hole. For example, in a grouping of holes viewed in
horizontal
> cross-section, the majority of holes will show the separation extending
from
> the 6 o'clock position to the 11 o'clock position. Any suggestions on what
> process/processes the vendor should look to for troubleshooting?
>
> Thanks,
> David Smith
> Benchmark Electronics
>
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> ##############################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in
> the body:
> To subscribe:   SUBSCRIBE TECHNET <your full name>
> To unsubscribe:   SIGNOFF TECHNET
> ##############################################################
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
> information.
> If you need assistance - contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> ##############################################################
>

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2