Hi, Netters



Could someone explain what these terms mean ?

 

1)  H.P.L.T(Hole Plugging Land Technology)    

 2)  T.C.L(Thermal Capacitance Technology)       

 3)  B,R.T(Buried Resistor Technology)        

 4)  M.R.T(Mixed Resin Layer)        

 5)  M.I.C(Mutiple Impedance Control)       

 6)  C.D.T(Cabity Down Type)      

 7)  H.F.C(High Frequency Cntrol)      

 8)  D.L.S(Dielect Lead semiconductdor)     

 9)  M.P.A.T(Multi Part Ass'y Technology)     

10)  T.A.T(Three Axis Technology)     



Thank you in advance.







Minsu Lee

Senior Researcher

R&D Team  # 2

Doosan Electro-Materials Co.