A few years ago, I saw wafer bumping machine using molten metal jet .
This technology was developed by MPM corporation which is screen printer vender.
However, recently I haven't heard any informations about metal jet bumping.
Does anyone know that this technology is available now for wafer CSP?

Thanks in advance.
--------------
Fumiaki Shigeoka

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################