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April 2000

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Subject:
From:
Bill Butman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 13 Apr 2000 12:31:54 -0700
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text/plain (37 lines)
Folks,
Looking for info on Berg Pins regarding a condition
that is not typically seen in manufacturing, but may
arise in rework.  IPC 610, in Chapt 6 addresses these
pins and solder condition / height on pins.  If solder
happens to run up the pins and you decide to rework
them by stripping the solder then re[plating with
gold, is there a restricition against the replated
gold getting on the solder filet or pads?



=====
Bill Butman
Circuit Technology Center
45 Research Drive
Haverhill, MA 01832

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