Excuse my ignorance, but could someone please  explain
 What is :...electrolytic "strike plate"
 TIA
  Mickey Weiner

> -----Original Message-----
> From: Mike Bailey [SMTP:[log in to unmask]]
> Sent: Mon April 10 2000 17:30
> To:   [log in to unmask]
> Subject:      [TN] Double Electroless Processing
>
> We have long had a practice regarding the processing of thick panels with
> high aspect ratio holes.  We perform standard desmear/electroless
> deposition
> followed by a 10 min electrolytic strike plate.  We then re-process the
> panels through electroless copper.  This has served us well in terms of
> protection from "bubble" voiding, but has become burdensome on our pattern
> cu throughput.  In all honesty, we have not seen bubble voids, but are
> probably a bit paranoid and hesitant to break the habit.  The logic of
> this
> process has been that if you must re-process the panels, why subject
> 99.99%
> of the holes to additional electroless.  It seemed better to lock them in
> with a strike plate first.
>
> Anyway, I was in a meeting the other day and it was suggested that we
> simply
> re-process the panels a 2nd time thorough electroless copper and eliminate
> the strike plate altogether.  Being the composed individual that I am, I
> bit
> my tongue, but was thinking. WHAT PART OF INTERCONNECT INTEGRITY DON'T YOU
> UNDERSTAND?????
>
> While I know that we have all done this double pass at one time or
> another,
> and it probably appeared to work satisfactorily, you must admit that the
> main objective at the time was just to get the panels through and avoid
> scrapping them at that point.
>
> I would appreciate a reality check and some feedback on this issue.
>
> Thanks in advance
>
>
> Mike Bailey
> Director of Engineering
> McCurdy Circuits Inc.
> 4900 E. Hunter Ave.
> Anaheim, CA  92870
> Phone: 714 507-4900 Ext 253
> FAX: 714 507-4911
> e-mail: [log in to unmask] <mailto:[log in to unmask]>
>
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