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April 2000

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Subject:
From:
Tran Tien Phat <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 11 Apr 2000 10:19:46 +0700
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (1882 bytes) , Spec.doc (33 kB)
Hi Van,
Of course you can  apply solder paste on CN pad and run through Reflow.
But you should pay attention some matters:
- Which side of PCB are CNs on? Your CNs should through Reflow only one
time.
- Solder paste may pass the hole and stick on the surface of supporting
plate of Printer, so you can exchange the supporting plate by supporting
pin.
- solder paste amount should be enough to decrease re-touch by solder iron.
I will attach our stencil specification of stencil opening for CN pad.
Please refer.
Bye
----- Original Message -----
From: Van Hoang Dinh <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, April 11, 2000 5:01 AM
Subject: [TN] THROUGH HOLE CONNECTOR?


> HI ALL,
> ANYONE HAVE EXPERIENCE ON USING THROUGH HOLE CONNECTORS AT REFLOW OVEN?
>
> I MEAN IS : I BUILT A CIRCUIT BOARD WITH ALMOST OF THE PARTS ARE SMT
(DOUBLE
> SIDES REFLOW),
> BUT THERE ARE 2 THROUGH HOLE CONNECTORS HAVE TO BE FIT ON. THEREFORE WE
HAVE
> TO HAND SOLDER THOSE CONNECTORS( TAKE LONG TIME).
> I HAVE BEEN THINKING OF DEPOSITE SOLDER PASTE ON TOP OF CONNECTORS
PAD(RING
> PADS) AND RUN THROUGH REFLOW.
>
> IF WE CAN
> WHAT SHOULD THE APERTURE SHAPE AND SIZE ON THE STENCIL OF THESE CONNECTORS
> PADS?
>
> THANKS,
> VAN
>
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