Leslie
Here is a chart I have found to be useful

Coeficients of  thermal expansion for materials
commonly found in passive chip components

Material                CTE (10-6   /K)
Alumina 96%         6.4
Silver                  19
Nickel                  13-15
Gold                    14.2
Glass                   <10
Copper                  17.2
Glass-epoxy ( R-4)          In-plane 11-15      Z-direction  60-80
Solder, Sn63/Pb37           21.0

Hope this helps

J S Sallo
Sallo Consulting Sewrvices
[log in to unmask]
760 346 6717

Ref. Electronic Materials Handbook, Vol. 1, Packaging, 1989,
ASM International)

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