Creep v GB sliding

Grain boundary sliding is just one mechanism of creep. There are several
others with different controlling features; sometimes grain size - some
not!

Which mechanism is dominant is controlled by the stress and temperature (
more strictly the strain rate).

So, it is the service condtions which strongly influence the dominant
creep mechanism, and to 'improve resistance' you need to  ensure that you
are enhancing the resistance to this particular mechanism. otherwise it is
a waste of time.

Incidentally, we are now measuring creep behaviour at -50C. It still takes
place in solders even at these very low temperatures.

Bill Plumbridge

Open University

Solder Research Group

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################