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April 2000

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Subject:
From:
Craig Mcglinchy <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 10 Apr 2000 09:02:33 +1200
Content-Type:
text/plain
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text/plain (32 lines)
I have an application where I wish to dissispate heat from one side of
the PCB through
to a heat sink on the other side.. Someone has mentioned filled via's..
ie vias that
are filled with some sort of thermal paste by the PCB fabricator. Has
anyone had any
experience with this, or know where I can find more information? Any
other suggestions
would also be welcome.

Thanks in advance.
--
Craig McGlinchy
PCB Designer
Tait Electronics Ltd
Ph. (64) 3 357-0779
Fax (64) 3 358-0432

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