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April 2000

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Subject:
From:
"HAN,JIANG-BO (A-Singapore,ex1)" <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Fri, 28 Apr 2000 18:47:15 +0800
Content-Type:
text/plain
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text/plain (55 lines)
Hello Sakamoto,

Do you have more detailed information which is able to share, say,
stress-strain curve at different temp, creep property, chemical composition
percentage of two alloys?

Thanks in advance.

Han JiangBo

-----Original Message-----
From: <Ichi $B!! (Bsakamoto>
[mailto:[log in to unmask]]
Sent: Friday, April 28, 2000 6:23 PM
To: [log in to unmask]
Subject: [LF] Material Properties





Dear Quadir
SnAgCu is 29MPa.
SnCu is 21MPa.
Thanks
----------------------  $BE>Aw<T (B: ichizo sakamoto/OMRONJP  $BE>AwF| (B:
2000/04/28 20:20
---------------------------


Yasir Abdul Quadir <[log in to unmask]> on 2000/04/28 18:59:49
 $BAw?.<T (B:  Yasir Abdul Quadir <[log in to unmask]>

"Leadfree Electronics Assembly E-Mail Forum." <[log in to unmask]>
$B$KJV?.$7$F$/$@$5 (B
       $B$$ (B; [log in to unmask] $B$KJV?.$7$F$/$@$5$$ (B


 $B08@h (B: [log in to unmask]
cc:    (bcc: ichizo sakamoto/OMRONJP)
 $B7oL> (B: [LF] Material Properties

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