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April 2000

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Subject:
Material Properties
From:
Yasir Abdul Quadir <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Fri, 28 Apr 2000 10:59:49 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines) 
Hello All,

Can somebody let me know the source where I can find the material
properties (especially yield stress w.r.t. temperature) for SnAgCu and
SnCu solder pastes.

Thanks

Yasir Abdul Quadir
NMRC, UCC
Cork
Ireland

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