Hi Chris,
In a message dated 04/18/0 5:46:39, [log in to unmask] writes:
>We are also developing a code of practice for temperature profiling during
>soldering. This project is a collaboration between four profiling equipment
>manufacturers, three OEMs, an oven manufacturer and ourselves. It is aimed
>at improving the accuracy of oven and wave soldering profiles as well as
>assisting OEMs to reduce the delta T across their assemblies during soldering
>and therefore reduce the maximum temperatures to which components might
>be exposed.
There is a task group at the IPC developing guidelines for proper techniques
for the reflow and wave solder profiling of electronic assemblies. It sounds
like we are both doing similar things. Could you send me a draft copy of your
"Code of Practice'?

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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