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Thermal Management on Printed Boards
Heavy copper on Printed Boards
The Greater Boston Chapter of the IPC Designer's Council will
hold its next meeting on Tuesday, May 9th at the Best Western
TLC Hotel in Waltham at 6pm.
Topic and Speaker:
Leighton MacMillan, CTO of Coretec, will present on Thermal
Management of printed circuit boards, with additional content
on heavy copper applications. Current techniques with FR4
are at their limits, even when using thermal vias and aluminum
heatsink layers. Thermally conductive laminates, commonly used
in power supply applications, hold promise in coping with high
speed and large devices whose power and thermal needs continue
to increase. As more applications also tend to use heavier
copper some review of the effects of 2-ounce and higher foils
will be included.
Agenda:
Please note there is a $15 meeting fee for members, $20 for
non-members. Pizza/soft drinks will be served.
6:00 Arrivals and Pizza
6:45 Chapter Business
7:00 Leighton MacMillan, Thermal Management on PWBs
Location/Directions:
The Best Western TLC Hotel in Waltham is located at exit 27A
off route 95/128, proceed east on Totten Pond Rd and the
hotel is on the left.
RSVP's needed:
Please RSVP by sending an email to [log in to unmask] with
the subject "RSVP IPC/DC" by Friday morning, May 5th. Please
treat this as a commitment to attend.
President's Note:
While we are very grateful to Lockheed for many years of use
of their cafeteria, that space is no longer available to us.
Therefore we've arranged for a hotel type of situation, which
we hope will suit the group for some time to come. While we've
kept the meeting costs as low as possible, we do need to work
with RSVP's to make sure we have enough space and food. Here's
hoping the group can work with the RSVP commitment in a very
much "last minute" design world.
I am very glad to welcome back Mr MacMillan to our group, he
has presented in the past and is always an engaging and topical
speaker. While we've all felt the effects of increased power
demands in various forms, the destination for all that power is
of course heat. If you've not yet had to make compromises in
physical design for thermal considerations, you will!
Mission:
Design is not called "do" for a reason. Done properly, the
design process is a creative problem solving discipline. To
address the packaging needs of electronics for today and to-
morrow, the physical designer needs an avenue to get exposed
and familiar with many different techniques and technologies.
The Greater Boston Chapter of the IPC Designer's Council is
committed to presenting stake holders from every aspect of the
packaging realm. Our hope is to help you gain insight and un-
derstanding of the many possibilities in solving core problems.
Your help and participation are most welcome.
Thanks and regards,
--
Jeff Seeger Applied CAD Knowledge Inc
Chief Technical Officer Tyngsboro, MA 01879
jseeger "at" appliedcad "dot" com 978 649 9800
President, Greater Boston Chatper, IPC Designer's Council
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