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Date: | Mon, 10 Apr 2000 19:03:10 EDT |
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Leslie
Here is a chart I have found to be useful
Coeficients of thermal expansion for materials
commonly found in passive chip components
Material CTE (10-6 /K)
Alumina 96% 6.4
Silver 19
Nickel 13-15
Gold 14.2
Glass <10
Copper 17.2
Glass-epoxy ( R-4) In-plane 11-15 Z-direction 60-80
Solder, Sn63/Pb37 21.0
Hope this helps
J S Sallo
Sallo Consulting Sewrvices
[log in to unmask]
760 346 6717
Ref. Electronic Materials Handbook, Vol. 1, Packaging, 1989,
ASM International)
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