In a message dated 04/05/2000 6:25:01 PM Central Daylight Time,
[log in to unmask] writes:

> I am looking for information on what should be done during simulated
>  environmental testing of product, such as what parameters to measure,
should
>  alterations be made to the product for test purposes, is trying to measure
>  the resistance of a solder joint an appropriate test measure.
>
>  Any help would be great
>
>  Jason

Hi Jason!

The information that you need, is not going to come soley from this list.
Automotive electronics reliability has to be very well documented and
formally done. Because of the liability that a company may face in this arena
of products.

I suggest that you contact "The Guru" about this, he's a fellow "Technetter".
This stuff doesn't come free, but as you probably know, should you get the
opportunity to build product for the automotive industry, the rewards are
great. But you have to do it right and document everything. Contact:

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737

E-mail: [log in to unmask], Website: www.engelmaier.com

You can't do any better...

-Steve Gregory-

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################