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March 2000

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Subject:
From:
Kelly Kovalovsky <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 3 Mar 2000 13:16:48 -0500
Content-Type:
text/plain
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text/plain (25 lines)
We are using an SRAM that is manufactured with a silicone based material.
The silicone acts as a mold release during component manufacture. We are
having problems coming up with a consistent process for attaching a
heatsink to this component and I understand it is due to the silicone.

Does anyone have any process suggestions for this situation? I am thinking
in terms of various adhesive materials. I would like to avoid changing the
component.

Kelly Kovalovsky

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