Hello guys,
about the Electroless Ni-P, we are experimenting this in one of our leadframes.
Is the P content affect the solderability of the material?
What about ductility? It seems that after forming the leads, big cracks @ the
bent lead radius were seen.
Does the grain size structure of the material affect this one? Which would be
better small grain size or big?
How to control the size?

After subjecting the material to different series of processing temperatures,
how it affects the property of the Ni-P.
Does annealing resolve this one?

Appreciate your technical expertise

Domo arigatou

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################