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March 2000

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From:
Andy Magee <[log in to unmask]>
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Date:
Fri, 31 Mar 2000 21:16:50 -0500
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There were a number of material supplier's papers published a few years
back at the various flex circuit conferences (IPC and others). Most
included a list something like "Why use adhesiveless?".

Here was my list:
Lower CTE for more reliable PTH.
Excellent thermal resistance for elevated temperature processing and
use, wire bonding applications, and multiple lamination cycles.
Thinner for greater flexibility, shorter heat transfer path, and space
savings.
Excellent dimensional stability for finer geometry features, and tighter
tolerances.
Single dielectric for uniform response to, plasma, laser and chemical
processing, as well as improved electrical properties.
Inherent flame retardancy.
Low water absorption.

These advantages were typically offset by higher cost, so they are not a
magic bullet to all your problems.

Andy Magee - Flex Guru
Senior Consultant - Bourton Group
[log in to unmask]
(815) 490-7593

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