Hello,

Some guru in package field mentioned reverse modeling and suggested me to
use it in solder joint reliability modeling. I have not heard of it
before. Have some one had any experience with it? Where can I find any
information?

Thanks,

Yuan Li
Research Associate
CAMPmode (Center For Advanced Manufacturing and Packaging of Microwave,
Optical and Digital Electronics)
University of Colorado at Boulder
CB 427, Boulder, CO 80309-0427
http://saagar.colorado.edu/~liy
(303)492-0481
(303)492-3498 (Fax)

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