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March 2000

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Subject:
From:
Dennis Ward <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 31 Mar 2000 14:32:05 -0500
Content-Type:
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Good afternoon everyone,

Problem of the day.

I'm trying to use a conventional via with a .8mm pitch microBGA.
The spacing between the soldermask clearance around the land
pad to the via pad is 2.7 mils. The via is cover with soldermask.
What sort of problems should I expect with this situation? Will
there be a problem? The via and land pad are not necessarily part
of the same net.

In case any one is interested the board parameters
.093 thick board - 10 layers
13 mil via - 23 mils pad
BGA - 9X9 .8mm pitch
BGA ball size @.45mm (17.7 mils)
BGA land pad @12 mils - 16 mil mask opening
SMOBC
LPI mask


Any input appreciated!

Dennis Ward
Net to Net Technologies, Inc.
603 427-0600
[log in to unmask]
http://www.nettonettech.com

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