The IPC Imaging/Developing Subcommittee (4-13) has organized a discussion
group
during the Spring IPC EXPO in San Diego on "Developing Photoresists for Fine
Line Applications".
The IPC Plating Subcommittee (4-14) welcomes all PCB manufacturers, who wish
to be involved in the creation of a "Gold Standard" to replace the defunct
Mil Spec.
Mike Toben who is heading the same effort for the ASTM will share with the
group where that team is to-day. Ideally IPC, MilSpec and ASTM would be in
agreement.
The meeting is scheduled for Monday April 3 from 1:30 to 3:00 pm in
conjunction with the IPC-Expo in San Diego. The meeting location will be in
the final program in the Committee Meeting section.
Subcommittee Chair
George Milad
Shipley Co.
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