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March 2000

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Subject:
From:
"(George Milad)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 31 Mar 2000 09:05:19 EST
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The IPC Imaging/Developing Subcommittee (4-13) has organized a discussion
group
during the Spring IPC EXPO in San Diego on "Developing Photoresists for Fine
Line Applications".

The IPC Plating Subcommittee (4-14)  welcomes all PCB manufacturers, who wish
to be involved in the creation of a "Gold Standard" to replace the defunct
Mil Spec.

Mike Toben who is heading the same effort for the ASTM will share with the
group where that team is to-day. Ideally IPC, MilSpec and ASTM would be in
agreement.

The meeting is scheduled for Monday April 3 from 1:30 to 3:00 pm in
conjunction with the IPC-Expo in San Diego.  The meeting location will be in
the final program in the Committee Meeting section.
Subcommittee Chair
George Milad
Shipley Co.

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