Scott, in contrast to Rudy's comments, my experience
with this bath is that it ALWAYS builds up an excess
of tin and becomes unstable.  Monitoring the SG
closely, and then dumping half the bath volume when it
got too high, became a routine.


--- "Scott E. Stewart" <[log in to unmask]> wrote:
>      Hi Everyone,
>      I just wanted to get some opinions on Shipley
> Ronal's Electroless
>      Copper 3350 Process which uses no Accelerator.
> We manufacture PC
>      Boards with hole sizes .018" to .008" and were
> interested in finding
>      out what present users of this process and past
> users of this process
>      think about this process.  Have there been
> issues with small hole
>      voiding?
>
>      Regards,
>
>      S. Stewart
>
>
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