Balki,
Take a look at the TI web site. search for PowerPAD or technical brief
SLMA002 and download the PDF file. The paper publishes thermal management
methods and results for a range of standard surface mount packages.
Alternatively, look in the SMI '98 proceedings. (page 151) Also in the
proceedings is a paper from ChipPAC presenting the thermal performance of a
modified  BGA. (page 769)

Regards,

-----Original Message-----
From: Balakrishnan Gopalan [mailto:[log in to unmask]]
Sent: 29 March 2000 15:39
To: [log in to unmask]
Subject: [TN] Thermally Enhanced Packages!


Hello TechNetters!

Can any of you suggest good literature (website,
articles or papers) as related to "Thermally Enhanced
Packages" with respect to

1. Applications & drive towards these packages
2. Methods & issues of Heat Spreader Attach
3. Issues in First & Second level reliability

Any level of information would be greatly appreciated.
Looking forward to your feedback.

Thanks & Regards

Balki
Graduate Research Associate
State University of New York
Binghamton, NY.


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