Hello TechNetters!
Can any of you suggest good literature (website,
articles or papers) as related to "Thermally Enhanced
Packages" with respect to
1. Applications & drive towards these packages
2. Methods & issues of Heat Spreader Attach
3. Issues in First & Second level reliability
Any level of information would be greatly appreciated.
Looking forward to your feedback.
Thanks & Regards
Balki
Graduate Research Associate
State University of New York
Binghamton, NY.
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