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March 2000

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Subject:
From:
"Scott E. Stewart" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 29 Mar 2000 08:04:02 -0500
Content-Type:
text/plain
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text/plain (26 lines)
     Hi Everyone,
     I just wanted to get some opinions on Shipley Ronal's Electroless
     Copper 3350 Process which uses no Accelerator.  We manufacture PC
     Boards with hole sizes .018" to .008" and were interested in finding
     out what present users of this process and past users of this process
     think about this process.  Have there been issues with small hole
     voiding?

     Regards,

     S. Stewart

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