I need some enlightenment/help. IPC-A-600F Section 4.1.7 addresses
solder wicking under the coverlay of flex circuits. The paragraph at the
top states migration does not extend into the bend or flex transition
area. Would this be the area where your measurements for acceptability
begin or does the measurement start at the clearance in the coverlay? No
one at IPC can answer this and they are waiting for their expert, Don
Dupriest (Lockheed) to return their call. Don if you are out there
please call me (505)345-5591 X3064.
Thanks in advance,
Rick Howieson
GTC

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