Hello,

I'm looking for resources (especially journal articles and publications) which
compare/contrast standard 3-layer flex circuits (i.e. where an adhesive layer
bonds a metal foil layer to a substrate such as polyimide) to adhesiveless flex
(i.e. where the metal layer is sputtered or vacuum deposited to the substrate
without the use of an adhesive).

In particular, I'm interested in what product or application requirements would
tend to steer one towards one of these construction vs. the other.

Thanks in advance!

Mark Lettang
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