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March 2000

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Subject:
From:
Jerry Cupples <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 28 Mar 2000 10:17:51 -0600
Content-Type:
text/plain
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text/plain (39 lines)
At 08:52 PM 3/28/00 +0800, you wrote:

>Hello intellectual people out there!
>
>
>
>does anybody knows a  company who is doing sputtering on wafers to make the Al
>       surface solderable?

I will ignore the potential risk of being deemed intellectual, and say this:

Mostek did this years ago with Ti-W co-sputtered, phasing to Cu using a multiple target sputtering setup. See US Patent 4,685,998 (at least intellectual property is mentioned).

We did this in the lab with MRC equipment, and in quasi-production with a Perkin-Elmer system. I'd suggest that you contact the equipment manufacturers, and inquire if they know of someone who uses their machines on a contract basis.

In the Dallas area, way back 17 years, there were a few small operations who would do small jobs, they were mainly in the business of putting harder surfaces on aircraft parts.

I hope this helps.


cheers,

Jerry Cupples
Interphase Corporation

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