I've run GR-78 EM tests on immersion silver and it passes.
It also passes with low-solids no-clean flux, comb up.
I can email data if you wish.

Some of my colleagues looked at the solderability
of immersion Ag, it's good, but HASL is better.

I suspect that hygroscopic dust/FMG exposure would quickly
degrade the solderability of immersion Ag.

----------
> From: Doug <[log in to unmask]>
> To: [log in to unmask]
> Subject: Re: [TN] Bellcore: Silver & Tin
> Date: Saturday, March 25, 2000 1:05 PM
>
> Forwarded from
>
> David Spencer wrote:
>
> > Background
> > I have been working on, or should I say
> > "I have been worked over by..", the
> > requirements of GR-78-CORE. Requirement
> > R6-8 states, "Silver shall not be used
> > as a conductor or contact finish. []
> > Tin shall not be used as a conductor or
> > contact finish unless subjected to an
> > approved reflow process."
> >
> > During our prototype phase, we have used
> > immersion gold. Our Mfg. Eng. wants to
> > move to immersion silver or white tin,
> > because the gold is expensive and can have
> > solderability/reliability problems related
> > to the nickel plating under the gold flash.
> >
> > Questions
> > Does anyone have a ruling on the use of
> > silver or white tin immersion finishes from
> > any of the RBOC's as it relates to the
> > requirements of GR-78-CORE?
> >
> > Are there any documented tests of these
> > finishes available, i.e. accelerated aging,
> > solderability, insulation resistance, etc ?
> >
> > Does anyone have experience with either of
> > these finishes in the hygroscopic dust/gaseous
> > contamination test suite from GR-63-CORE?
> >
> > Thanks for your help!
> > Dave Spencer
>
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