I have been battling SMT ceramic capacitor cracking problems for a while, as
I am sure most of you have.  I am experiencing cracking from mechanical and
most likely thermal stress as well.  I have addressed many of these issues
(depanelization, profile, etc...) using literature from MLC manufacturer's
technical information.  I am now looking for a general capacitor size vs.
strength data for various stresses.  I know that generally larger parts are
more likely to have problems but for each size of cap it is difficult to
compare.  I have looked at RAC data as well as IPC, and have not found
anything exactly like what I am looking for.

Does anyone know of a source of such information or the best place to start
compiling a list of my own?

Any suggestions would be appreciated.

Thanks

David Romero

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