TECHNET Archives

March 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Howieson, Rick" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 21 Mar 2000 16:32:23 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (140 lines)
Out of curiosity, where are these requirements stated?
Rick

>-----Original Message-----
>From:  Dewey Whittaker [SMTP:[log in to unmask]]
>Sent:  Tuesday, March 21, 2000 3:09 PM
>To:    [log in to unmask]
>Subject:       Re: [TN] Baking FR4 boards
>
>Alain Savard wrote:
>
>> Isn't the 72 hours before bake a requirement for polyimide instead of FR4?
>>
>> Alain Savard, B.Sc.
>> Chemical Process Analyst
>> CAE Electronics Ltd.
>> e-mail: [log in to unmask]
>>
>> -----Original Message-----
>> From: Dewey Whittaker
>> 1. Typically, for multi-layer (6-8 layers), FR4, SMT boards stored in an
>>air
>>
>> conditioned environment at about 50+/- 10% RH, how many months would you
>> allow
>> to pass before you would recommend baking them prior to reflow?
>> 2. What would be your bake cycle?
>> Thanks,
>> Charlie B.
>> ####################################
>> Without knowing any other variables and being conservative,72 hours is your
>> window for the Aerospace Industry.
>> Dewey
>> --
>> Dewey Whittaker
>>
>> ##############################################################
>> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
>> ##############################################################
>> To subscribe/unsubscribe, send a message to [log in to unmask] with following
>>text in
>> the body:
>> To subscribe:   SUBSCRIBE TECHNET <your full name>
>> To unsubscribe:   SIGNOFF TECHNET
>> ##############################################################
>> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
>>additional
>> information.
>> If you need assistance - contact Keach Sasamori at [log in to unmask] or
>> 847-509-9700 ext.5315
>> ##############################################################
>
>If it were Polyimide,it would be 24 hours(realistically 8 hours).Through
>testing and proper storage conditions,each design could have a much greater
>processing window.4 hours at 100 degrees C. is the bake.
>Dewey
>
>--
>Dewey Whittaker
>Honeywell -- Air Transport Systems Division
>US Mail: P.O. Box 21111 MS: M16A2 Phoenix AZ 85036
>Phone: +1 602 436 436-2766
>NSFnet: [log in to unmask]
>
>
>
><!doctype html public "-//w3c//dtd html 4.0 transitional//en">
><html>
>Alain Savard wrote:
><blockquote TYPE=CITE>Isn't the 72 hours before bake a requirement for
>polyimide instead of FR4?
><p>Alain Savard, B.Sc.
><br>Chemical Process Analyst
><br>CAE Electronics Ltd.
><br>e-mail: [log in to unmask]
><p>-----Original Message-----
><br>From: Dewey Whittaker
><br>1. Typically, for multi-layer (6-8 layers), FR4, SMT boards stored
>in an air
><p>conditioned environment at about 50+/- 10% RH, how many months would
>you
><br>allow
><br>to pass before you would recommend baking them prior to reflow?
><br>2. What would be your bake cycle?
><br>Thanks,
><br>Charlie B.
><br>####################################
><br>Without knowing any other variables and being conservative,72 hours
>is your
><br>window for the Aerospace Industry.
><br>Dewey
><br>--
><br>Dewey Whittaker
><p>##############################################################
><br>TechNet Mail List provided as a free service by IPC using LISTSERV
>1.8c
><br>##############################################################
><br>To subscribe/unsubscribe, send a message to [log in to unmask] with
>following
>text in
><br>the body:
><br>To subscribe:&nbsp;&nbsp; SUBSCRIBE TECHNET &lt;your full name>
><br>To unsubscribe:&nbsp;&nbsp; SIGNOFF TECHNET
><br>##############################################################
><br>Please visit IPC web site (<a
>href="http://www.ipc.org/html/forum.htm">http://www.ipc.org/html/forum.htm</a
>>)
>for additional
><br>information.
><br>If you need assistance - contact Keach Sasamori at [log in to unmask] or
><br>847-509-9700 ext.5315
><br>##############################################################</blockquot
>e>
>If it were Polyimide,it would be 24 hours(realistically 8 hours).Through
>testing and proper storage conditions,each design could have a much greater
>processing window.4 hours at 100 degrees C. is the bake.
><br>Dewey
><pre>--&nbsp;
>Dewey Whittaker
>Honeywell -- Air Transport Systems Division
>US Mail: P.O. Box 21111 MS: M16A2 Phoenix AZ 85036
>Phone: +1 602 436 436-2766
>NSFnet: [log in to unmask]</pre>
>&nbsp;</html>
>

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2