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March 2000

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Subject:
From:
Van Hoang Dinh <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 Mar 2000 07:49:54 +1100
Content-Type:
text/plain
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text/plain (79 lines)
Good morning Nancy

Thank you very much for your help. I really need the table 6-1. would you
please fax for me.
Facsimile : 61 2 9748 7065

----- Original Message -----
From: Nancy Trumbull <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, March 22, 2000 6:07 AM
Subject: Re: [TN] Solder Ball


Hi Van

Per IPC 610C page A-1
Electrical Clearance
The minimum spacing between conductors between conductive patterns, layer to
layer conductive spaces ( z axis ) and between conductive materials ( such
as conductive markings or mounting hardware )  and conductors shall be in
accordance with Table 6-1.
If needed let me know and I'll fax it to you.

Again from 610c page 6-23
Entrapped / encapsulated / attached is intended to mean normal service
environment of the product will not cause a solder ball to become dislodged.
Testing would be a customer standard.
As: vibration, reliability. shipping................ so on so on.
Please remember the words
entrap and encapsulate and what they  mean.
Hope this helped
There's  my two cents again
Nancy T




>>> Van Hoang Dinh <[log in to unmask]> 03/20/00 04:16PM >>>
Good morning all,

1.Anyone known where can I look for a definition of ELECTRICAL DESIGN
CLEARANCE ?

2.How we define or experiment test to prove that the solder balls are
entrapped and not cause a solder ball to become dislodged?

THANKS ALL

VAN

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