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March 2000

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Subject:
From:
"Brad L. Matthies" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 21 Mar 2000 12:33:44 -0600
Content-Type:
text/plain
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text/plain (28 lines)
Technetters,

We, like everyone else, will be switching to a no clean flux in our SMT
area.  I am interested in any ones responses to making this switch.
What issues have you encountered?  Are you having to redesign your
stencils to control the volume of solder paste?  What have you been
doing with your PCB/parts suppliers to control the quality of the raw
goods you receive for use with no clean?

Thanks for your input,
Brad M.
Process Engineer
Raven Industries, Inc.

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