Hi, TechNetters!
For some reason, my letter did not come through the first time (so I was
noticed by the list server).
I asked two questions:
1. The CS via plugging near BGA pads  was done with epoxy by
overprinting plugs over the vias. The plugs are higher than the BGA
pads. Is it OK for solder paste printing on the BGA pads?
2. Some BGA pads are dewetted, but not entirely. We observed this by
checking pad by pad. Our incoming inspection department does not reject
circuits with this degree of dewetting on normal SMT pads, and if the
problem arises during manufacturing, touch up is done. But with BGA it
is another story.
How do you deal with this problem?
Regards,
Gaby

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