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March 2000

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Subject:
From:
David Fish <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Mar 2000 22:43:12 -0800
Content-Type:
text/plain
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text/plain (62 lines)
Werner:  What documents:

* Design Guidelines for Reliable Pin Through Hole Technology Printed Board Assemblies
* Pin Through Hole Design & Land Pattern Standard
* Guidelines for Accelerated Reliability Testing of Pin Through Hole Solder Attachments

Thank you

Dave Fish

Werner Engelmaier wrote:

> Hi Dave,
> I surely do not understand your question, and the 2 responses that you have
> received indicate to me that these people also did not understand what it is
> you need.
> Would you restate your query? I was heavily involved with 2 of these
> documents and somewhat with the third, so I should be able to help you.
> Werner Engelmaier
>
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