Hi Jeff,
Your problem is one that has not be addressed fully, and in any case will
have 'it depends' answers.
1) solder-filled vias are more reliable than unfilled vias, PROVIDED that the
fill is without voids; vias with solder fills with vods will be less reliable
because of the stress concentration created by the voids. HOWEVER, this is
only a real issue for severe use conditions like automotive and some military.
2) allowing vias to fill with liquid solder during the wave soldering process
has led to partial solder joint reflows and desturbed solder joints on the
top side--this is particularly to be avoided with BGAs.
This is not exactly a deluge, but my 7.3 cents (5 cents after inflation).

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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