I agree with Werner Engelmaier.

I also suggest that you take into account the soldering atmosphere. For
example, if your equipment can operate with nitrogen or air, you may wish to
document the processing atmosphere.

My recommendation is that you run in nitrogen, whether or not you use IR
Reflow or Convection. It will yield cleaner solder joints, with less visible
residues, and improve solderability.

This is especially true when running Pb-Free solders.

Lee Whiteman
Senior Manufacturing Engineer
ACI / EMPF
Telephone: (610) 362-1200; Ext. 208
FAX: (610) 362-1290
E-Mail: [log in to unmask]

 -----Original Message-----
 From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
 Sent: Friday, March 17, 2000 2:54 PM
 To: [log in to unmask]
 Subject: Re: [TN] Oven Profile Recommendations?


 Hi Rick,
 Determining and maintaining reflow oven profiles for each assembly
 is a good
 idea regardless of the reflow method used (excepting vapor phase, of
 course). While the heat transfer has improved with the
 'Convection' ovens vs.
 the 'IR' ovens, the size and thermal masses of components have gotten more
 varied.

 Werner Engelmaier
 Engelmaier Associates, L.C.
 Electronic Packaging, Interconnection and Reliability Consulting
 7 Jasmine Run
 Ormond Beach, FL  32174  USA
 Phone: 904-437-8747, Fax: 904-437-8737
 E-mail: [log in to unmask], Website: www.engelmaier.com

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