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March 2000

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Subject:
From:
"McGlaughlin, Jeffrey A" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 17 Mar 2000 07:21:21 -0500
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Ed -

I just completed a design for a 0.8mm pitch 176 ball Micro-star (tm) BGA and
through-hole vias. The vias were 0.008" (0.010" drill) finished hole size in
a 0.018" pad. I would not call these exactly  normal but my fabricator says
that they should be able to produce them (contact me of line for who)...
This is a six layer mixed signal design, with a 12 amp power supply, talk
about nightmares.

Jeffrey A. McGlaughlin
Sr. PCB Designer
Battelle Memorial Institute
Columbus Ohio
[log in to unmask]


        -----Original Message-----
        From:   Brunker Ed [SMTP:[log in to unmask]]
        Sent:   Friday, 17 March, 2000 05:50
        To:     [log in to unmask]
        Subject:        [TN] Micro BGAs

        Hi,
        Anyone using normal through vias for micro BGAs, 0.8mm pitch???
        Regards
        Edward Brunker
        Principal Process Engineer

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