In a message dated 3/16/00 1:21:32, [log in to unmask] writes:
>While you're on the subject of gold, when soldering to gold plated tracks,
does the
>presence of the gold make a difference to the soldering temperature?

Hi Richard,
The answer is no; the Au layer, if thick enough, will protect the underlying
Ni from oxidation. It also will promote a faster spreading, not wetting, of
the liquid solder on the Ni surface because of its very fast disolution rate
in Sn. But you still need to wet to Ni, that is disolve some Ni into Sn to
form a metalurgical bond, and that takes lots more thermal energy than
wetting to Cu.

Werner Engelmaier

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