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March 2000

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Subject:
From:
Franklin Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 16 Mar 2000 07:32:14 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (204 lines)
~laughing~

Franklin

----- Original Message -----
From: Paul Klasek <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, March 15, 2000 8:12 PM
Subject: Re: [TN] ??: [TN] Gold Removal


> Understandable, no point of holding back being full of it........
>
> -----Original Message-----
> From: Howieson, Rick [mailto:[log in to unmask]]
> Sent: Thursday, 16 March 2000 13:09
> To: [log in to unmask]
> Subject: Re: [TN] ??: [TN] Gold Removal
>
>
> Methane, amen. Here goes this one........
>
> >-----Original Message-----
> >From:  Paul Klasek [SMTP:[log in to unmask]]
> >Sent:  Wednesday, March 15, 2000 6:04 PM
> >To:    [log in to unmask]
> >Subject:       Re: [TN] ??: [TN] Gold Removal
> >
> >Oh, gee, ehm, Ryan, mate, close, not sure if enough :
> >1
> >Steve's maths ?(sorry Steve, you ARE one of the LEGENDS):
> >"nearly" 75u" = 1.875um (or close enough);
> >is NOT in line with ITRI's recommended 1.5um ceiling :
> >me the coward never had guts to digest even 1um on soldered pads .
> >I'll give you; with latest pad size trends (smaller); you may creep touch
> >higher,
> >but i do know if i'd got totally stoned and placed more than 1umAu on
> specs,
> >my fellow in QA would be after my skin .
> >Besides, Tim 's been just quizzing me where the hell do i squeeze 0.5um
> from
> >flush;
> >whining bitterly all he gets from his fabs is 0.25um tops on flash .
> >Record i MEASURED on flash was some 0.8um,
> >so i presume it's my turn in Tim's shoes :
> >Where would you get saturation's which throws 75u" on Ni ?
> >Presume only academic maths ?
> >
> >And the bible talks, i think (?) about 4% , not 3,
> >but i won't be making scenes about that one
> >(less is better, almost, hahaha)
> >
> >And NiAu (0.5umAu average = 20u") costs us less than HASL .
> >
> >Getting gold ears from all this off hip traffic ;
> >getting dark here too: Inge : deleted some dozen methaned messages today
!
> >
> >All in good humor Ryan , ok ?, just let's retain the functionality.
> >
> >
> >Paul
> >
> >-----Original Message-----
> >From: Ryan Grant [mailto:[log in to unmask]]
> >Sent: Thursday, 16 March 2000 10:47
> >To: [log in to unmask]
> >Subject: Re: [TN] ??: [TN] Gold Removal
> >
> >
> >I agree with this.  Do the math.  If a five mil stencil is used, and the
> >component leads are NOT gold plated, the board gold thickness can reach
> >nearly 75 micro inches before the percentage of gold in the joint reaches
> >the magical number of 3%.  Below 3%, gold is not shown to induce
> >embrittlement.  If you are soldering to BGA balls, there is even more Tin
> to
> >dilute the gold, so the gold thickness can be even thicker.  The reason
for
> >the 5 to 8 micro inches of gold thickness is, that is the MINIMUM needed
to
> >prevent oxidation of the nickel.  Thicker gold is more expensive in terms
> of
> >processing and material cost, and it is unnecessary, so why do it?
> >
> >Of course, if I buy a new stereo, and it has a scratch on it, I'll take
it
> >back.  Functionality be damned.  Rick can do the same with his boards.
> >
> >Ryan G.
> >
> >> -----Original Message-----
> >> From: Timothy Reeves [SMTP:[log in to unmask]]
> >> Sent: Wednesday, March 15, 2000 3:08 PM
> >> To:   [log in to unmask]
> >> Subject:      Re: [TN] ??: [TN] Gold Removal
> >>
> >> Does anyone agree with this? I hope not.
> >>
> >> > ----------
> >> > From:         Jonathan A Noquil
> >> > Sent:         Tuesday, March 14, 2000 15:57
> >> > Subject:      Re: ??: [TN] Gold Removal
> >> >
> >> > Higher gold thickness does not affect
> >> > reliability (solderability),
> >>
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