Good Morning TechNet:  Got your coffee yet?

You all are absolutely great!  Seriously, I mean that and it's a compliment.
You all took this gold removal thing and brainstormed just about every way
possible to to get me to the end item of producing the board.  I have
discussed and forwarded your comments to the Manufacturing Engineer directly
involved.  My advice to him is as follows:
1.      We have limited quantities of boards left to run.
2.      The issue at the supplier has been resolved to get the thickness we
want.
3.      Option One:  Re-profile these remaining CCAs to allow enough time to
wash the gold and create wetting over the entire pad, first time through the
waves.
4.      Option Two:  Don't worry about it, just run the CCAs twice, and move
them on down the line.  There is no capacity issue, we have time to re-run
the boards, and tests have shown that this will take care of the problem.

I also made sure he was aware that an acceptable solder joint on a gold pad
does not mean all the gold must be removed.  It must, however, show signs of
good wetting onto the pad.  Preferrably, I would like to see all the gold
removed on the pads/areas to be soldered.

Don't worry, I am not going to try the cyanide, si-a-nide, cy-ya-nide, see I
am not even sure of how to spell it, so I better not fool around with it.
Ha!

It's nice to log into memory banks of this old brain the options provided by
you all.

Thanks a ton.  Now lets worry about a much larger issue.  "How soon can we
get on the golf course?"

Ron Hollandsworth

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